CMP
Well-T’s colloidal silica enables precise material removal and surface refinement, delivering smooth, low-defect finishes across semiconductor, optical, and high-precision component applications.
Designed for demanding polishing processes, our portfolio combines high-purity electronic-grade products with flexible particle size platforms to support applications from rough polishing to final finishing.
Key Advantages
Controlled Particle Engineering
Tailored particle size and distribution enable consistent polishing performance, removing surface defects while minimizing material damage.
High Purity, Clean Processing
Ultra-low metal and organic impurities support stringent requirements in semiconductor, optical, and precision manufacturing.
Stable Dispersion, Consistent Results
Excellent dispersion stability prevents agglomeration and settling, ensuring reliable performance across processes and production batches.
Broad Material Compatibility
Compatible with silicon, glass, ceramics and precision metals, enabling versatile surface finishing with improved uniformity and precision.
Featured Products
| Product | Features | Density (g/cm³) | Particle Size (m²/g) | Surface Area (nm) | SiO₂% | Na₂O% | pH | Viscoity (mm²/s) |
|---|---|---|---|---|---|---|---|---|
| CMP SERIES (4) | ||||||||
 SK-6050 HP | Low-Sodium, High-pH | 1.4 | 60-90 | 70 | 50% | ≤150ppm | 9.0-10.5 | ≤25 |
| SD-10050 HP | Near-PPB Purity | 1.4 | 90-110 | 50 | 50% | ≤10ppm | 9.0-10.5 | ≤25 |
| SK-6050 UHP | Low-Sodium, High-pH | 1.4 | 60-90 | 70 | 50% | ≤150ppm | 9.0-10.5 | ≤25 |
| SD-10050 UHP | Near-PPB Purity | 1.4 | 90-110 | 50 | 50% | ≤10ppm | 9.0-10.5 | ≤25 |
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30 years of experience. Tailored solutions for your colloidal silica challenges.
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