CMP Grade Colloidal Silica
Engineered for CMP applications, Well-T’s CMP Grade combines near-PPB metal purity with consistent particle size for stable polishing and superior surface quality.
Key Features
- Near-PPB metal impurity control
- High-purity colloidal silica for CMP
- Consistent particle size for stable polishing
- Strict contamination control throughout production
Featured Products
| Product | Features | Density (g/cm³) | Surface Area (m²/g) | Particle Size (nm) | SiO₂% | Na₂O% | pH | Viscosity (mm²/s) |
|---|---|---|---|---|---|---|---|---|
| CMP SERIES (4) | ||||||||
| Low-Sodium, High-pH | 1.4 | 60-90 | 70 | 50% | ≤150ppm | 9.0-10.5 | ≤25 | |
| Near-PPB Purity | 1.4 | 90-110 | 50 | 50% | ≤10ppm | 9.0-10.5 | ≤25 | |
| Low-Sodium, High-pH | 1.4 | 60-90 | 70 | 50% | ≤150ppm | 9.0-10.5 | ≤25 | |
| Near-PPB Purity | 1.4 | 90-110 | 50 | 50% | ≤10ppm | 9.0-10.5 | ≤25 | |
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